Inventor · disambiguated record
Myung Gun Park
Also filed as: PARK MYUNG GUN
4 granted patents·2 pending applications·5 citations·filing 2010–2013
63Inventor score
Top patents by PatentIndex Score
6 records- 0165US8716854B2Multi-chip packageSK HYNIX INC·Filed 2012·Granted May 6, 2014·2 cites·20 claims
- 0264US8823183B2Bump for semiconductor package, semiconductor package having bump, and stacked semiconductor packageKIM KI YOUNG·Filed 2010·Granted Sep 2, 2014·2 cites·17 claims
- 0358US9209133B2Semiconductor apparatusSK HYNIX INC·Filed 2013·Granted Dec 8, 2015·1 cites·17 claims
- 0443US8829689B2Module substrate with feature for replacement of faulty chips, semiconductor module having the same, and method for manufacturing the semiconductor moduleKIM KI YOUNG·Filed 2010·Granted Sep 9, 2014·0 cites·13 claims
- 0536US2012205797A1Bump and semiconductor device having the sameBAE JIN HO·Filed 2011·Application pending·0 cites
- 0633US2012112342A1Semiconductor device and stacked semiconductor packageHYUN SUNG HO·Filed 2011·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →