Inventor
YOSHII HARUYUKI
JP8 patents
⚠️ This page may combine multiple inventors who share the name “YOSHII HARUYUKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NAMICS CORP
5 patentsUS6498200B1Dec 24, 2002
Cationically polymerizable resin composition
NAMICS CORP31 citations92
US6841415B2Jan 11, 2005
Flip chip mounting method which avoids void formation between a semiconductor chip and a substrate
NAMICS CORP10 citations73
US9805998B2Oct 31, 2017
Liquid sealing material and electronic component using same
NAMICS CORP4 citations71
US9748158B2Aug 29, 2017
Liquid sealing material and electronic component using same
NAMICS CORP0 citations50
US10941280B2Mar 9, 2021
Liquid sealing material for copper bump, and resin composition for use as same
NAMICS CORP0 citations44