Inventor
PRAKUZHY MANU J
US7 patents
Patents
7 patentsUS9165873B1Oct 20, 2015
Semiconductor package having etched foil capacitor integrated into leadframe
TEXAS INSTRUMENTS INC10 citations83
US10622290B2Apr 14, 2020
Packaged multichip module with conductive connectors
TEXAS INSTRUMENTS INC2 citations70
US9373572B2Jun 21, 2016
Semiconductor package having etched foil capacitor integrated into leadframe
TEXAS INSTRUMENTS INC2 citations61
US11538742B2Dec 27, 2022
Packaged multichip module with conductive connectors
TEXAS INSTRUMENTS INC0 citations59
US10497643B1Dec 3, 2019
Patterned die pad for packaged vertical semiconductor devices
TEXAS INSTRUMENTS INC0 citations49
US10607927B2Mar 31, 2020
Spot-solderable leads for semiconductor device packages
TEXAS INSTRUMENTS INC0 citations47
US9142496B1Sep 22, 2015
Semiconductor package having etched foil capacitor integrated into leadframe
TEXAS INSTRUMENTS INC0 citations40