Inventor

KIRBY KYLE K

US206 patents

⚠️ This page may combine multiple inventors who share the name “KIRBY KYLE K”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KIRBY KYLE K

MICRON TECHNOLOGY INC

Semiconductor substrates with unitary vias and via terminals, and associated systems and methods

Semiconductor component having plate, stacked dice and conductive vias

Methods for forming vias in microelectronic devices, and methods for packaging microelectronic devices

Wafer level methods for fabricating multi-dice chip scale semiconductor components

Multi-dice chip scale semiconductor components and wafer level methods of fabrication

Microelectronics devices, having vias, and packaged microelectronic devices having vias

Through-wafer interconnects for photoimager and memory wafers

Frame structure and semiconductor attach process for use therewith for fabrication of image sensor packages and the like, and resulting packages

Methods of forming conductive vias and methods of forming multichip modules including such conductive vias

Method for fabricating semiconductor components with thinned substrate, circuit side contacts, conductive vias and backside contacts

Semiconductor interconnect having conductive spring contacts

Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methods

Microfeature workpieces and methods for forming interconnects in microfeature workpieces

Microelectronic devices and methods for forming interconnects in microelectronic devices

Substrate, semiconductor die, multichip module, and system including a via structure comprising a plurality of conductive elements

Through-substrate interconnect fabrication methods

Multi-dice chip scale semiconductor components

Microelectronic devices and methods for forming interconnects in microelectronic devices

Semiconductor component having plate and stacked dice

Semiconductor interconnect having semiconductor spring contacts

Probe card for use with microelectronic components, and methods for making same

Ramp-lock lifting device

Microelectronic devices and methods for forming interconnects in microelectronic devices

Image sensor packages and frame structure thereof

Method of forming vias in semiconductor substrates without damaging active regions thereof and resulting structures

Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methods

Semiconductor components and assemblies including vias of varying lateral dimensions

Packaged microelectronic imagers and methods of packaging microelectronic imagers

Test system for semiconductor components having conductive spring contacts

Methods for forming vias in microelectronic devices, and methods for packaging microelectronic devices

Method for fabricating an interconnect for semiconductor components

Methods of fabricating interconnects for semiconductor components

Methods for forming vias varying lateral dimensions

Substrate, semiconductor die, multichip module, and system including a via structure comprising a plurality of conductive elements

Method for fabricating a semiconductor interconnect having conductive spring contacts

Compliant contact pin assembly, card system and methods thereof

Wafer reinforcement structure and methods of fabrication

Microelectronic imagers and methods of packaging microelectronic imagers

Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers

Methods of plating via interconnects

Methods of fabricating interconnects for semiconductor components including a through hole entirely through the component and forming a metal nitride including separate precursor cycles

Methods of coating and singulating wafers

Interconnect having spring contacts

Semiconductor interconnect having compliant conductive contacts

Compliant contract structures, contactor cards and test system including same

Test system and test method with interconnect having semiconductor spring contacts

Methods of fabricating interconnects for semiconductor components including plating solder-wetting material and solder filling

Methods of forming via plugs using an aerosol stream of particles to deposit conductive materials

Ramp-lock fitting device

APTINA IMAGING CORP

Methods for protecting imaging elements of photoimagers during back side processing