Inventor
WANG GUOTAO
CN11 patents
⚠️ This page may combine multiple inventors who share the name “WANG GUOTAO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
8 patentsUS10700051B2Jun 30, 2020
Multi-chip packaging
INTEL CORP4 citations82
US10256198B2Apr 9, 2019
Warpage control for microelectronics packages
INTEL CORP2 citations71
US12476235B2Nov 18, 2025
Multi-chip packaging
INTEL CORP0 citations61
US12199085B2Jan 14, 2025
Multi-chip packaging
INTEL CORP0 citations61
US11817444B2Nov 14, 2023
Multi-chip packaging
INTEL CORP0 citations61
US11348911B2May 31, 2022
Multi-chip packaging
INTEL CORP0 citations61
US11114388B2Sep 7, 2021
Warpage control for microelectronics packages
INTEL CORP0 citations61
US7659192B2Feb 9, 2010
Methods of forming stepped bumps and structures formed thereby
INTEL CORP1 citations45