Inventor

TOMITA YOSHIHIRO

JP138 patents

⚠️ This page may combine multiple inventors who share the name “TOMITA YOSHIHIRO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TOMITA YOSHIHIRO

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD

Method for producing an electronic component using direct bonding

Method of manufacturing a piezoelectric acoustic wave device

Surface acoustic wave element, method for producing the same and surface acoustic wave device using the same

Acceleration sensor and shock detecting device using the same

Piezoelectric device and method of manufacturing the same

Piezoelectric resonator and method for fabricating the same

Electronic component and method for producing the same

Method of manufacturing a composite substrate and a piezoelectric device using the substrate

Piezoelectric device and method of manufacturing the same

Method of processing a piezoelectric device

Energy trapping piezoelectric device and producing method thereof

Method for producing a surface acoustic wave element

Portable device

Liquid jetting apparatus having a piezoelectric drive element directly bonded to a casing

Displacement control actuator

Method of manufacturing a composite substrate and a piezoelectric device using the substrate

Acceleration sensor and acceleration apparatus using acceleration sensor

Acceleration sensor and acceleration apparatus using acceleration sensor

MITSUBISHI ELECTRIC CORP

Semiconductor device comprising stacked semiconductor elements

Lead frame including frame-cutting slit for lead-on-chip (LOC) semiconductor device and semiconductor device incorporating the lead frame

Resin-packaged semiconductor device with flow prevention dimples

Flip chip semiconductor device

Semiconductor device having a chip, reinforcing plate, and sealing material sharing a common rear surface

Semiconductor device comprising a semiconductor element mounted on a substrate and covered by a wiring board

Leadframe including frame-cutting slit for lead-on-chip (LOC) semiconductor device and semiconductor device incorporating the leadframe

Method of making a lead on chip (LOC) semiconductor device

Structure and method for mounting semiconductor devices

Method for mounting semiconductor elements

Circuit electrode connected to a pattern formed on an organic substrate and method of forming the same

Electrode of semiconductor device, method of manufacturing thereof, and the semicondutor device

Semiconductor device including a heat radiation plate

Semiconductor device

Semiconductor device

Packaged semiconductor device and manufacturing method thereof

INTEL CORP

Low cost package warpage solution

Low cost package warpage solution

Microelectronic devices with high frequency communication modules having compound semiconductor devices integrated on a package fabric

Microelectronic devices designed with high frequency communication devices including compound semiconductor devices integrated on a die fabric on package

Package with dielectric or anisotropic conductive (ACF) buildup layer

Picture frame stiffeners for microelectronic packages

FUJITSU LTD

Echo canceler

Relay and exchange system for time division multiplex data

Variable rate coder

Coding transmission equipment for carrying out coding with adaptive quantization

PANASONIC IP MAN CO LTD

Flexible substrate including stretchable sheet

Tactile sensor that includes two sheets each having at least either flexibility or elasticity

RENESAS TECH CORP

Method of fabricating semiconductor device having a chip, reinforcing plate, and sealing material sharing a common rear surface

NEC CORP

Semiconductor device with a binary alloy bonding layer

GANESAN SANKA

Package-on-package interconnect stiffener

RYODEN SEMICONDUCTOR SYST ENG

Solder material, junctioning method, junction material, and semiconductor device