Inventor

ICHIRYU TAKASHI

JP40 patents

⚠️ This page may combine multiple inventors who share the name “ICHIRYU TAKASHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ICHIRYU TAKASHI

PANASONIC CORP

Method for producing connection member

Flexible semiconductor device

Magnetic sheet with stripe-arranged magnetic grains, RFID magnetic sheet, magnetic shielding sheet and method of manufacturing the same

Metal particles-dispersed composition and flip chip mounting process and bump-forming process using the same

Flexible substrate, multilayer flexible substrate

Flip chip mounting process and bump-forming process using electrically-conductive particles as nuclei

Flexible substrate having interlaminar junctions, and process for producing the same

Manufacturing method of flexible semiconductor device

Flexible semiconductor device and method for manufacturing same

Flip chip mounting method and bump forming method

Flip-chip mounting method and bump formation method

Flip chip mounting method, flip chip mounting apparatus and flip chip mounting body

Flip chip mounting body and method for mounting such flip chip mounting body and bump forming method

Bidirectional switch and bidirectional switch device including the switch

Manufacturing method of flexible semiconductor device and flexible semiconductor device

Manufacturing method of flexible semiconductor device and flexible semiconductor device

Flip chip mounting body, flip chip mounting method and flip chip mounting apparatus

Electronic component package including sealing resin layer, metal member, ceramic substrate, and electronic component and method for manufacturing the same

PANASONIC IP MAN CO LTD

Flexible substrate including stretchable sheet

Flexible touch sensor and method of manufacturing the same

Stretchable flexible substrate including first insulating layer, second insulating layer, first metal layer, and second metal layer

Transparent electrode and method for manufacturing the same

Gate drive circuit, and semiconductor breaker

Gate drive circuit, and semiconductor breaker

Gate drive circuit, and semiconductor breaker

Bidirectional switch, electrical device, and multi-level inverter

Semiconductor device including heat-dissipating metal multilayer having different thermal conductivity, and method for manufacturing same

Bidirectional switch module and bidirectional switch

Driver circuit and switch system

Electronic component package including electronic component, metal member, and sealing resin

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD

Connection member and mount assembly and production method of the same

Flexible substrate having interlaminar junctions, and process for producing the same

Optical transmission channel board, board with built-in optical transmission channel, and data processing apparatus

Flexible substrate, multilayer flexible substrate and process for producing the same

ICHIRYU TAKASHI

Flexible semiconductor device and method for producing the same

Method for making a semiconductor device on a flexible substrate

KITAE TAKASHI

Flip chip mounting method and bump forming method

HIRANO KOICHI

Flip-chip mounting method and bump formation method

NAKATANI SEIICHI

Flip chip mounting body, flip chip mounting method and flip chip mounting apparatus

ASAHI TOSHIYUKI

Module with a built-in component, and electronic device with the same