Inventor
CHEN HAN-HSING
TW6 patents
⚠️ This page may combine multiple inventors who share the name “CHEN HAN-HSING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TU HSIU-WEN
3 patentsUS8563350B2Oct 22, 2013
Wafer level image sensor packaging structure and manufacturing method for the same
TU HSIU-WEN7 citations82
US8440488B2May 14, 2013
Manufacturing method and structure for wafer level image sensor module with fixed focal length
TU HSIU-WEN8 citations82
US8828777B2Sep 9, 2014
Wafer level image sensor packaging structure and manufacturing method of the same
TU HSIU-WEN0 citations50
KINGPAK TECH INC
3 patentsUS10727141B2Jul 28, 2020
Method for inspecting sensor package structure, inspection apparatus, and focus assistant loader of inspection apparatus
KINGPAK TECH INC4 citations66
US8378441B2Feb 19, 2013
Manufacturing method and structure of a wafer level image sensor module with package structure
KINGPAK TECH INC0 citations50
US11094056B2Aug 17, 2021
Defect inspection method for sensor package structure
KINGPAK TECH INC0 citations45