Inventor
TSENG CHAO KUN
TW14 patents
⚠️ This page may combine multiple inventors who share the name “TSENG CHAO KUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
FOXCONN PREC COMPONENTS CO LTD
5 patentsUS6412546B1Jul 2, 2002
Heat dissipation device for integrated circuits
FOXCONN PREC COMPONENTS CO LTD68 citations95
US6318451B1Nov 20, 2001
Heat sink for integrated circuit
FOXCONN PREC COMPONENTS CO LTD16 citations83
US6273185B1Aug 14, 2001
Heat sink and retainer for electronic integrated devices
FOXCONN PREC COMPONENTS CO LTD11 citations73
US6317323B1Nov 13, 2001
Heat sink assembly for an electrical socket
FOXCONN PREC COMPONENTS CO LTD5 citations58
US6442836B1Sep 3, 2002
Method of making folded fin
FOXCONN PREC COMPONENTS CO LTD1 citations50
HON HAI PREC IND CO LTD
4 patentsUS6728107B2Apr 27, 2004
Mounting assembly for heat sink
HON HAI PREC IND CO LTD24 citations91
US6195874B1Mar 6, 2001
Folded fin forming method, machine and folded fin obtained therefrom
HON HAI PREC IND CO LTD11 citations68
US6452800B2Sep 17, 2002
Heat sink assembly for dissipating heat of an electronic package mounted on an electrical socket
HON HAI PREC IND CO LTD5 citations62
US6321584B1Nov 27, 2001
Method and machine for making folded fins for a heat sink
HON HAI PREC IND CO LTD5 citations54
CHI MEI COMM SYSTEMS INC
3 patentsUS7576291B2Aug 18, 2009
Key button mechanism and an electronic device using the same
CHI MEI COMM SYSTEMS INC36 citations90
US9118140B2Aug 25, 2015
Chip card holder with protective cover for portable electronic devices
CHI MEI COMM SYSTEMS INC15 citations79
US8018527B2Sep 13, 2011
Connecting structure and digital camera module employing the same
CHI MEI COMM SYSTEMS INC2 citations60