Inventor

HSIAO CHENG-SHIU

TW2 patents

Patents

2 patents

US6593662B1Jul 15, 2003

Stacked-die package structure

SILICONWARE PRECISION INDUSTRIES CO LTD203 citations98

US6476469B2Nov 5, 2002

Quad flat non-leaded package structure for housing CMOS sensor

SILICONWARE PRECISION INDUSTRIES CO LTD277 citations96