Inventor

LEE KWANGDUK DOUGLAS

US53 patents

⚠️ This page may combine multiple inventors who share the name “LEE KWANGDUK DOUGLAS”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LEE KWANGDUK DOUGLAS

APPLIED MATERIALS INC

Ultra high selectivity ashable hard mask film

Ultra high selectivity doped amorphous carbon strippable hardmask development and integration

Ultra-high modulus and etch selectivity boron-carbon hardmask films

Method and apparatus of processing wafers with compressive or tensile stress at elevated temperatures in a plasma enhanced chemical vapor deposition system

Gas flow profile modulated control of overlay in plasma CVD films

Highly etch selective amorphous carbon film

Highly etch selective amorphous carbon film

Methods to improve in-film particle performance of amorphous boron-carbon hardmask process in PECVD system

Ultra-high modulus and etch selectivity boron-carbon hardmask films

Methods, systems, and apparatus for processing substrates using one or more amorphous carbon hardmask layers

Method of in situ ceramic coating deposition

Cleaning process for removing boron-carbon residuals in processing chamber at high temperature

Plasma processing using multiple radio frequency power feeds for improved uniformity

Thick tungsten hardmask films deposition on high compressive/tensile bow wafers

Gas flow profile modulated control of overlay in plasma CVD films

Loadlock integrated bevel etcher system

Method and apparatus of achieving high input impedance without using ferrite materials for RF filter applications in plasma chambers

Loadlock integrated bevel etcher system

Loadlock integrated bevel etcher system

Method for PECVD overlay improvement

Edge hump reduction faceplate by plasma modulation

Method for PECVD overlay improvement

Method of in situ ceramic coating deposition

Ultra-high modulus and etch selectivity boron-carbon hardmask films

Pedestal for substrate processing chambers

Pedestal for substrate processing chambers

Plasma processing using multiple radio frequency power feeds for improved uniformity

Ultra-high modulus and etch selectivity boron carbon hardmask films

Gas flow profile modulated control of overlay in plasma CVD films

Processing chamber deposition confinement

Methods, systems, and apparatus for processing substrates using one or more amorphous carbon hardmask layers

Graded ARC for high NA and immersion lithography

Treatment for high-temperature cleans

Deposition of metal silicide layers on substrates and chamber components

Selective deposition of hardmask

Highly etch selective amorphous carbon film

Highly etch selective amorphous carbon film

High temperature electrostatic chucking with dielectric constant engineered in-situ charge trap materials

Plasma-enhanced chemical vapor deposition of carbon hard-mask

Multi-pressure bipolar electrostatic chucking

Electrostatic chucking process

Nitrogen-doped carbon hardmask films

Methods of dry stripping boron-carbon films

Dual RF for controllable film deposition

Deposition of metal silicide layers on substrates and chamber components

LEE KWANGDUK DOUGLAS

System and method for electric load recognition from centrally monitored power signal and its application to home energy management

Methods of dry stripping boron-carbon films

Method for depositing conformal amorphous carbon film by plasma-enhanced chemical vapor deposition (PECVD)

SEAMONS MARTIN JAY

Ultra high selectivity doped amorphous carbon strippable hardmask development and integration

Planarizing etch hardmask to increase pattern density and aspect ratio