Inventor

PADHI DEENESH

US96 patents

⚠️ This page may combine multiple inventors who share the name “PADHI DEENESH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

PADHI DEENESH

APPLIED MATERIALS INC

Post rinse to improve selective deposition of electroless cobalt on copper for ULSI application

Ultra-conformal carbon film deposition

Method to deposit functionally graded dielectric films via chemical vapor deposition using viscous precursors

Ultra high selectivity doped amorphous carbon strippable hardmask development and integration

Blocker plate bypass to distribute gases in a chemical vapor deposition system

Selective metal encapsulation schemes

Electropolishing of metallic interconnects

Electroless deposition method

Electroless deposition method

Electroless deposition method over sub-micron apertures

Liquid precursors for the CVD deposition of amorphous carbon films

Multi-layer stacks for 3D NAND extendibility

Method for depositing an amorphous carbon film with improved density and step coverage

Aluminum nitride barrier layer

Interface engineering to improve adhesion between low k stacks

Method and apparatus for reducing organic depletion during non-processing time periods

Strengthening the interface between dielectric layers and barrier layers with an oxide layer of varying composition profile

Multi-layer stacks for 3D NAND extendability

Dry etch rate reduction of silicon nitride films

UV assisted CVD AlN film for BEOL etch stop application

Borane mediated dehydrogenation process from silane and alkylsilane species for spacer and hardmask application

Methods for depositing dielectric barrier layers and aluminum containing etch stop layers

Selective poreseal deposition prevention and residue removal using SAM

Enhancing electrical property and UV compatibility of ultrathin blok barrier film

Semiconductor substrate supports with improved high temperature chucking

Method and system for high temperature clean

Ultra-conformal carbon film deposition

Interconnect structures and methods of formation

Film stack overlay improvement

Method for forming a hydrophobic and icephobic coating

Methods to improve the in-film defectivity of PECVD amorphous carbon films

Low-k dielectric with self-forming barrier layer

Method to enable high temperature processing without chamber drifting

Method for critical dimension reduction using conformal carbon films

Bipolar electrostatic chuck electrode with self-induced DC voltage

Silicon oxide gap fill using capacitively coupled plasmas

Systems and methods of seasoning electrostatic chucks with dielectric seasoning films

Helium-free silicon formation

Profile shaping for control gate recesses

Profile shaping for control gate recesses

LAM RES CORP

Inhibitor plasma mediated atomic layer deposition for seamless feature fill

Inhibitor plasma mediated atomic layer deposition for seamless feature fill

Method for selectively sealing ultra low-k porous dielectric layer using flowable dielectric film formed from vapor phase dielectric precursor

SEAMONS MARTIN JAY

Ultra high selectivity doped amorphous carbon strippable hardmask development and integration

REILLY PATRICK

Deposition of an amorphous carbon layer with high film density and high etch selectivity

PADHI DEENESH

Methods to improve the in-film defectivity of PECVD amorphous carbon films

YU HANG

Amorphous carbon deposition method for improved stack defectivity

KONECNI ANTHONY

Composite removable hardmask

SANKARAKRISHNAN RAMPRAKASH

Confined process volume PECVD chamber

DU BOIS DALE R

Shadow ring for modifying wafer edge and bevel deposition