Inventor · disambiguated record

Xunqing Shu

Also filed as: SHU XUNQING

1 granted patent·78 citations·filing 2008–2008

52Inventor score

Technology areasH10W

Files withHK APPLIED SCIENCE & TECH RES1

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1 record

0193US7683459B2Bonding method for through-silicon-via based 3D wafer stackingHK APPLIED SCIENCE & TECH RES·Filed 2008·Granted Mar 23, 2010·78 cites·15 claims

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Xunqing Shu — Patent Inventor | PatentIndex