Inventor
CHUNG CHANG HWA
HK15 patents
⚠️ This page may combine multiple inventors who share the name “CHUNG CHANG HWA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HK APPLIED SCIENCE & TECH RES
7 patentsUS7683459B2Mar 23, 2010
Bonding method for through-silicon-via based 3D wafer stacking
HK APPLIED SCIENCE & TECH RES78 citations94
US8011237B2Sep 6, 2011
Piezoelectric module for energy harvesting, such as in a tire pressure monitoring system
HK APPLIED SCIENCE & TECH RES27 citations92
US8030208B2Oct 4, 2011
Bonding method for through-silicon-via based 3D wafer stacking
HK APPLIED SCIENCE & TECH RES16 citations82
US7902727B1Mar 8, 2011
Apparatus and method for generating electricity using piezoelectric material
HK APPLIED SCIENCE & TECH RES3 citations61
US7879438B2Feb 1, 2011
Substrate warpage-reducing structure
HK APPLIED SCIENCE & TECH RES5 citations59
US7860634B2Dec 28, 2010
Method and apparatus for identification of wheels of a vehicle and a vehicle comprising same
HK APPLIED SCIENCE & TECH RES4 citations57
US8031484B2Oct 4, 2011
IC packages with internal heat dissipation structures
HK APPLIED SCIENCE & TECH RES1 citations51
MICROELECTRONICS & COMPUTER
4 patentsUS4860088AAug 22, 1989
Electrical interconnect tape
MICROELECTRONICS & COMPUTER37 citations92
US5041003AAug 20, 1991
Electrical connector system
MICROELECTRONICS & COMPUTER28 citations90
US5036379AJul 30, 1991
Electrical interconnect tape
MICROELECTRONICS & COMPUTER16 citations73
US5049087ASep 17, 1991
Electrical connector using flexible circuit tape
MICROELECTRONICS & COMPUTER17 citations66