Inventor

SENK DAVID

US3 patents

⚠️ This page may combine multiple inventors who share the name “SENK DAVID”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

THURAIRAJARATNAM ARITHARAN

1 patent

US8889999B2Nov 18, 2014

Multiple layer printed circuit board with unplated vias

THURAIRAJARATNAM ARITHARAN41 citations88

CISCO TECH INC

1 patent

US10631407B1Apr 21, 2020

Circuit board with non-plated hole interposed between plated holes to prevent formation of conductive anodic filament

CISCO TECH INC5 citations63

HINAGA SCOTT T

1 patent

US8559678B2Oct 15, 2013

Method and apparatus for determining surface roughness of metal foil within printed circuits

HINAGA SCOTT T0 citations32