Inventor
LIM SANGWHOO
MY10 patents
⚠️ This page may combine multiple inventors who share the name “LIM SANGWHOO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
LIN CHARLES W C
8 patentsUS8241962B2Aug 14, 2012
Method of making a semiconductor chip assembly with a post/base heat spreader, a signal post and a cavity
LIN CHARLES W C6 citations84
US8232576B1Jul 31, 2012
Semiconductor chip assembly with post/base heat spreader and ceramic block in post
LIN CHARLES W C10 citations84
US8212279B2Jul 3, 2012
Semiconductor chip assembly with post/base heat spreader, signal post and cavity
LIN CHARLES W C10 citations84
US8193556B2Jun 5, 2012
Semiconductor chip assembly with post/base heat spreader and cavity in post
LIN CHARLES W C7 citations84
US8076182B2Dec 13, 2011
Method of making a semiconductor chip assembly with a post/base heat spreader and a cavity over the post
LIN CHARLES W C14 citations84
US9018667B2Apr 28, 2015
Semiconductor chip assembly with post/base heat spreader and dual adhesives
LIN CHARLES W C4 citations73
US8415703B2Apr 9, 2013
Semiconductor chip assembly with post/base/flange heat spreader and cavity in flange
LIN CHARLES W C6 citations73
US8207553B2Jun 26, 2012
Semiconductor chip assembly with base heat spreader and cavity in base
LIN CHARLES W C5 citations62
BRIDGE SEMICONDUCTOR CORP
2 patentsUS7939375B2May 10, 2011
Method of making a semiconductor chip assembly with a post/base heat spreader and a cavity in the post
BRIDGE SEMICONDUCTOR CORP8 citations84
US8003416B2Aug 23, 2011
Method of making a semiconductor chip assembly with a post/base heat spreader and dual adhesives
BRIDGE SEMICONDUCTOR CORP6 citations73