Inventor

KOO JUN MO

SG48 patents

⚠️ This page may combine multiple inventors who share the name “KOO JUN MO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KOO JUN MO

SAMSUNG SDI CO LTD

Polarizing plate and optical display apparatus comprising the same

Optical film, polarizing plate including same, and display device including same

Polarizing plate and optical display device including same

Polarizing plate and optical display device comprising same

Polarizing plate and optical display comprising the same

Polarizing plate and optical display apparatus comprising the same

Polarizing plate and optical display apparatus comprising the same

Polarizing plate and optical display device comprising same

Polarizing plate and display device including same

Optical film, polarizing plate comprising the same, and optical display apparatus comprising the same

Polarizing plate and optical display apparatus comprising the same

Polarizing plate and optical display apparatus comprising the same

Optical display device module and optical display device including same

Polarizing plate and optical display device including same

Polarizer protective film, polarization plate comprising same, and optical display apparatus comprising same

Polarizing plate and optical display apparatus comprising same

Polarizing plate and optical display device comprising same

PAGAILA REZA A

Semiconductor device and method of forming RDL along sloped side surface of semiconductor die for z-direction interconnect

Semiconductor device and method of forming FO-WLCSP with discrete semiconductor components mounted under and over semiconductor die

Semiconductor device and method of forming interposer with opening to contain semiconductor die

Semiconductor device and method of forming stepped interposer for stacking and electrically connecting semiconductor die

Semiconductor device and method of forming sacrificial adhesive over contact pads of semiconductor die

Semiconductor device and method of embedding bumps formed on semiconductor die into penetrable adhesive layer to reduce die shifting during encapsulation

Semiconductor device and method of forming protective layer over exposed surfaces of semiconductor die

Semiconductor device and method of forming bond-on-lead interconnection for mounting semiconductor die in FO-WLCSP

Semiconductor device and method of embedding bumps formed on semiconductor die into penetrable adhesive layer to reduce die shifting during encapsulation

Semiconductor device and method of forming thermally conductive layer between semiconductor die and build-up interconnect structure

Semiconductor device and method of forming anisotropic conductive film between semiconductor die and build-up interconnect structure

Semiconductor device and method of forming thermally conductive layer between semiconductor die and build-up interconnect structure

Semiconductor device and method of forming Fo-WLCSP with discrete semiconductor components mounted under and over semiconductor die

STATS CHIPPAC LTD

Semiconductor device with protective layer over exposed surfaces of semiconductor die

Semiconductor device and method of forming bond-on-lead interconnection for mounting semiconductor die in Fo-WLCSP

Semiconductor device and method of forming RDL using UV-cured conductive ink over wafer level package

Semiconductor device and method of using substrate having base and conductive posts to form vertical interconnect structure in embedded die package

Semiconductor device including RDL along sloped side surface of semiconductor die for Z-direction interconnect

SK TELECOM CO LTD

CDMA modulation and demodulation method reducing interference and a communication system using the same

Rake receiving apparatus for direct sequence code division multiple access system

Method for synchronizing reverse link and transmission method using synchronous reverse link

Apparatus and method for generating pilot beacon signal in base stations of CDMA system

SAMSUNG ELECTRONICS CO LTD

Hand-shake correction method and apparatus of camera module for use in mobile device

Optical image stabilizer for camera lens assembly

Apparatus and method for proportional-integral-derivative control

Optical demultiplexer having bragg diffration grating and optical communication module using the optical demultiplexer

KOO JUN MO

Semiconductor device and method of forming TSV interposer with semiconductor die and build-up interconnect structure on opposing surfaces of the interposer

Semiconductor device and method of bonding different size semiconductor die at the wafer level

STATS CHIPPAC PTE LTD

Semiconductor device and method of forming interposer with opening to contain semiconductor die

Semiconductor device and method of using substrate having base and conductive posts to form vertical interconnect structure in embedded die package

JCET SEMICONDUCTOR SHAOXING CO LTD

Semiconductor device and method of forming sacrificial adhesive over contact pads of semiconductor die