Inventor
SHIN SEUNG-HUN
KR27 patents
⚠️ This page may combine multiple inventors who share the name “SHIN SEUNG-HUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
16 patentsUS9443892B2Sep 13, 2016
Image sensor and method of forming the same
SAMSUNG ELECTRONICS CO LTD11 citations84
US9728572B2Aug 8, 2017
Via structures including etch-delay structures and semiconductor devices having via plugs
SAMSUNG ELECTRONICS CO LTD5 citations83
US9165974B2Oct 20, 2015
Electronic devices including multiple semiconductor layers
SAMSUNG ELECTRONICS CO LTD12 citations82
US10672823B2Jun 2, 2020
Image sensors
SAMSUNG ELECTRONICS CO LTD8 citations81
US9455284B2Sep 27, 2016
Stack type image sensor
SAMSUNG ELECTRONICS CO LTD3 citations73
US7586170B2Sep 8, 2009
Image sensors including impurity layer adjacent isolation region
SAMSUNG ELECTRONICS CO LTD6 citations73
US10229949B2Mar 12, 2019
Via structures including etch-delay structures and semiconductor devices having via plugs
SAMSUNG ELECTRONICS CO LTD2 citations72
US10477082B2Nov 12, 2019
Camera assembly and electronic device including the same
SAMSUNG ELECTRONICS CO LTD4 citations68
US9825081B2Nov 21, 2017
Semiconductor devices having a pad structure
SAMSUNG ELECTRONICS CO LTD2 citations67
US8043927B2Oct 25, 2011
Method of manufacturing a CMOS image sensor
SAMSUNG ELECTRONICS CO LTD2 citations63
US7998782B2Aug 16, 2011
Fabrication of image sensor with improved signal to noise ratio
SAMSUNG ELECTRONICS CO LTD3 citations63
US10943939B2Mar 9, 2021
Via structures including etch-delay structures and semiconductor devices having via plugs
SAMSUNG ELECTRONICS CO LTD0 citations62
US10971537B2Apr 6, 2021
Image sensors
SAMSUNG ELECTRONICS CO LTD1 citations60
US10867857B2Dec 15, 2020
Method of cutting substrate and method of singulating semiconductor chips
SAMSUNG ELECTRONICS CO LTD1 citations59
US7884400B2Feb 8, 2011
Image device and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD1 citations52
US12074141B2Aug 27, 2024
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations50