Inventor

MURAKAWA KATUHIKO

JP7 patents

Patents

7 patents

US5965211AOct 12, 1999

Electroless copper plating solution and process for formation of copper film

NIPPON DENSO CO21 citations91

US5039338AAug 13, 1991

Electroless copper plating solution and process for formation of copper film

NIPPON DENSO CO29 citations91

US4834796AMay 30, 1989

Electroless copper plating solution and process for electrolessly plating copper

NIPPON DENSO CO27 citations88

US4956014ASep 11, 1990

Electroless copper plating solution

NIPPON DENSO CO8 citations72

US4935267AJun 19, 1990

Process for electrolessly plating copper and plating solution therefor

NIPPON DENSO CO14 citations72

US4814009AMar 21, 1989

Electroless copper plating solution

NIPPON DENSO CO7 citations72

US4790876ADec 13, 1988

Chemical copper-blating bath

NIPPON DENSO CO2 citations61