Inventor

TAI HSIN-CHIH

US87 patents

⚠️ This page may combine multiple inventors who share the name “TAI HSIN-CHIH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAI HSIN-CHIH

OMNIVISION TECH INC

Masked laser anneal during fabrication of backside illuminated image sensors

Backside illuminated imaging sensor with improved infrared sensitivity

Backside illuminated image sensor having deep light reflective trenches

Image sensor with pixel units having mirrored transistor layout

Image sensor pixel cell with global shutter having narrow spacing between gates

Image sensor having curved micro-mirrors over the sensing photodiode and method for fabricating

Image sensor pixel cell with switched deep trench isolation structure

Method of forming dual size microlenses for image sensors

Die seal ring for integrated circuit system with stacked device wafers

Die seal ring for integrated circuit system with stacked device wafers

Dual-facing camera assembly

Seal ring support for backside illuminated image sensor

Seal ring support for backside illuminated image sensor

Image sensor with low electrical cross-talk

Image sensor with dual element color filter array and three channel color output

Backside illuminated imaging sensor with silicide light reflecting layer

Multilayer image sensor pixel structure for reducing crosstalk

Image sensor with buried self aligned focusing element

Dual-facing camera assembly

VENEZIA VINCENT

Image sensor with buried self aligned focusing element

Image sensor having curved micro-mirrors over the sensing photodiode and method for fabricating

CMOS image sensor with heat management structures

Dual-sided image sensor

Trench transfer gate for increased pixel fill factor

Multilayer image sensor pixel structure for reducing crosstalk

Backside illuminated image sensor having deep light reflective trenches

Image sensor with contact dummy pixels

CHEN GANG

Partial buried channel transfer device for image sensors

Image sensor having metal grid with a triangular cross-section

Dual-facing camera assembly

Large CMOS image sensor pixel with improved performance

In-pixel high dynamic range imaging

Methods of forming varying depth trenches in semiconductor devices

MAO DULI

CMOS image sensor with improved photodiode area allocation

Image sensor having supplemental capacitive coupling node

Integrated circuit stack with integrated electromagnetic interference shielding

Image sensor having supplemental capacitive coupling node

Laser anneal for image sensors

QIAN YIN

Wafer dicing using scribe line etch

Backside illuminated imaging sensor with vertical pixel sensor

Backside illuminated imaging sensor with improved infrared sensitivity

Pad design for circuit under pad in semiconductor devices

TAI HSIN-CHIH

Backside illuminated image sensor with stressed film

Backside illuminated imaging sensor with reinforced pad structure

DAI TIEJUN

Circuit and photo sensor overlap for backside illumination image sensor

Circuit and photo sensor overlap for backside illumination image sensor

ZHENG WEI

Image sensor with improved black level calibration

TAIWAN SEMICONDUCTOR MFG

Method and system of semiconductor fabrication fault analysis

OMNI VISION TECHNOLOGIES INC

Backside illuminated imaging sensor with improved angular response

QIAN WEIDONG

Image sensor with micro-lenses of varying focal lengths