Inventor

MAO DULI

US158 patents

⚠️ This page may combine multiple inventors who share the name “MAO DULI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MAO DULI

OMNIVISION TECH INC

Masked laser anneal during fabrication of backside illuminated image sensors

Backside illuminated imaging sensor with improved infrared sensitivity

Backside illuminated image sensor having deep light reflective trenches

Pixel array with embedded split pixels for high dynamic range imaging

Stacked-chip backside-illuminated SPAD sensor with high fill-factor

CMOS image sensor with dual floating diffusions per pixel for flicker-free detection of light emitting diodes

Image sensor with hybrid deep trench isolation

Horizontal avalanche photodiode

Conductive trench isolation

Vertical gate guard ring for single photon avalanche diode pitch minimization

Image sensor with pixel units having mirrored transistor layout

Image sensor pixel cell with global shutter having narrow spacing between gates

High-dynamic-range color image sensors and associated methods

High dynamic range image sensor with virtual high-low sensitivity pixels

Stacked image sensor

Isolation structure in photodiode

Die seal ring for integrated circuit system with stacked device wafers

Die seal ring for integrated circuit system with stacked device wafers

Dual-facing camera assembly

Seal ring support for backside illuminated image sensor

Seal ring support for backside illuminated image sensor

Image sensor with low electrical cross-talk

Image sensor with dual element color filter array and three channel color output

Backside illuminated imaging sensor with silicide light reflecting layer

Multilayer image sensor pixel structure for reducing crosstalk

Systems and methods for detecting light-emitting diode without flickering

Big-small pixel scheme for image sensors

Image sensor with buried self aligned focusing element

Image sensors for capturing both visible light images and infrared light images, and associated systems and methods

VENEZIA VINCENT

Image sensor with buried self aligned focusing element

CMOS image sensor with heat management structures

Dual-sided image sensor

Trench transfer gate for increased pixel fill factor

Multilayer image sensor pixel structure for reducing crosstalk

Backside illuminated image sensor having deep light reflective trenches

MAO DULI

CMOS image sensor with improved photodiode area allocation

Image sensor having supplemental capacitive coupling node

Integrated circuit stack with integrated electromagnetic interference shielding

Image sensor having supplemental capacitive coupling node

Laser anneal for image sensors

CHEN GANG

Partial buried channel transfer device for image sensors

Image sensor having metal grid with a triangular cross-section

Dual-facing camera assembly

Large CMOS image sensor pixel with improved performance

QIAN YIN

Wafer dicing using scribe line etch

Backside illuminated imaging sensor with vertical pixel sensor

Backside illuminated imaging sensor with improved infrared sensitivity

Pad design for circuit under pad in semiconductor devices

TAI HSIN-CHIH

Backside illuminated image sensor with stressed film

Backside illuminated imaging sensor with reinforced pad structure