Inventor
HEYDINGER MATTHEW
US5 patents
⚠️ This page may combine multiple inventors who share the name “HEYDINGER MATTHEW”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HEWLETT PACKARD CO
4 patentsUS5880017AMar 9, 1999
Method of bumping substrates by contained paste deposition
HEWLETT PACKARD CO117 citations97
US5672542ASep 30, 1997
Method of making solder balls by contained paste deposition
HEWLETT PACKARD CO125 citations97
US5539153AJul 23, 1996
Method of bumping substrates by contained paste deposition
HEWLETT PACKARD CO187 citations97
US5586715ADec 24, 1996
Method of making solder balls by contained paste deposition
HEWLETT PACKARD CO59 citations94