Inventor

LEI YI-YANG

TW26 patents

⚠️ This page may combine multiple inventors who share the name “LEI YI-YANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LEI YI-YANG

TAIWAN SEMICONDUCTOR MFG CO LTD

Semiconductor package including dies having high-modulus dielectric layer and manufacturing method thereof

Package structure and manufacturing method of package structure thereof

Semiconductor structure and method of forming the same

Semiconductor structure and method of forming the same

Semiconductor devices, methods of manufacture thereof, and packaged semiconductor devices

Method of manufacturing semiconductor structure

Package structure and manufacturing method of package structure thereof

Polishing pad, polishing apparatus and method of manufacturing semiconductor package using the same

Process including a re-etching process for forming a semiconductor structure

Package structure and method of fabricating the same

Workpiece chuck, workpiece handling apparatus, manufacturing method of semiconductor package

Lamination process, and manufacturing method of semiconductor package using a chuck

Lamination process, and manufacturing method of semiconductor package using a chuck

Chuck, lamination process, and manufacturing method of semiconductor package using the same

Method of manufacturing semiconductor structure

Semiconductor devices, methods of manufacture thereof, and packaged semiconductor devices

Semiconductor device and manufacturing method thereof

Semiconductor structure having a conductive feature comprising an adhesion layer and a metal region over and contacting the adhesion layer

Package structure and method of fabricating the same

Method of manufacturing semiconductor structure

Semiconductor structure and manufacturing method thereof

LEI YI-YANG

UBM etching methods for eliminating undercut

Method for reducing UBM undercut in metal bump structures

Cleaning residual molding compound on solder bumps

HWANG CHIEN LING

Method of forming semiconductor die

TAIWAN SEMICONDUCTOR MFG COMPANY LTD

Package structure with enhancement structure and manufacturing method thereof