Inventor
KURITA YOICHIRO
JP91 patents
⚠️ This page may combine multiple inventors who share the name “KURITA YOICHIRO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
RENESAS ELECTRONICS CORP
14 patentsUS9406602B2Aug 2, 2016
Electronic device
RENESAS ELECTRONICS CORP9 citations93
US8633591B2Jan 21, 2014
Electronic device
RENESAS ELECTRONICS CORP10 citations93
US8354340B2Jan 15, 2013
Electronic device and method of manufacturing the same
RENESAS ELECTRONICS CORP23 citations93
US8349649B2Jan 8, 2013
Semiconductor device and manufacturing method thereof
RENESAS ELECTRONICS CORP26 citations93
US8035231B2Oct 11, 2011
Semiconductor device and method of manufacturing the same
RENESAS ELECTRONICS CORP17 citations93
US10224318B2Mar 5, 2019
Electronic device
RENESAS ELECTRONICS CORP6 citations84
US9847325B2Dec 19, 2017
Electronic device
RENESAS ELECTRONICS CORP3 citations84
US9324699B2Apr 26, 2016
Semiconductor device
RENESAS ELECTRONICS CORP3 citations84
US8975750B2Mar 10, 2015
Electronic device
RENESAS ELECTRONICS CORP7 citations84
US8823174B2Sep 2, 2014
Electronic device
RENESAS ELECTRONICS CORP7 citations84
US7931411B2Apr 26, 2011
Optical transmission apparatus to which optical cable is connected
RENESAS ELECTRONICS CORP8 citations84
US7928001B2Apr 19, 2011
Electronic device and method of manufacturing the same
RENESAS ELECTRONICS CORP14 citations84
US8890305B2Nov 18, 2014
Semiconductor device
RENESAS ELECTRONICS CORP3 citations74
US7977158B2Jul 12, 2011
Manufacturing method for electronic devices
RENESAS ELECTRONICS CORP6 citations74
NEC ELECTRONICS CORP
13 patentsUS7795721B2Sep 14, 2010
Semiconductor device and method for manufacturing the same
NEC ELECTRONICS CORP122 citations99
US6930396B2Aug 16, 2005
Semiconductor device and method for manufacturing the same
NEC ELECTRONICS CORP81 citations96
US7800233B2Sep 21, 2010
Semiconductor device and method of manufacturing the same
NEC ELECTRONICS CORP32 citations93
US7598117B2Oct 6, 2009
Method for manufacturing semiconductor module using interconnection structure
NEC ELECTRONICS CORP26 citations93
US6822336B2Nov 23, 2004
Semiconductor device
NEC ELECTRONICS CORP31 citations93
US7238548B2Jul 3, 2007
Flip-chip type semiconductor device, production process for manufacturing such flip-chip type semiconductor device, and production process for manufacturing electronic product using such flip-chip type semiconductor device
NEC ELECTRONICS CORP17 citations91
US7812446B2Oct 12, 2010
Semiconductor device
NEC ELECTRONICS CORP8 citations84
US7622801B2Nov 24, 2009
Thin planar semiconductor device
NEC ELECTRONICS CORP10 citations84
US7538022B2May 26, 2009
Method of manufacturing electronic circuit device
NEC ELECTRONICS CORP8 citations84
US6753238B2Jun 22, 2004
Semiconductor device and manufacturing method thereof
NEC ELECTRONICS CORP15 citations84
US7667312B2Feb 23, 2010
Semiconductor device including a heat-transmitting and electromagnetic-noise-blocking substance and method of manufacturing the same
NEC ELECTRONICS CORP10 citations79
US7772032B2Aug 10, 2010
Manufacturing method for electronic devices
NEC ELECTRONICS CORP6 citations74
US7370786B2May 13, 2008
Bonding method and bonding apparatus
NEC ELECTRONICS CORP5 citations71
TOSHIBA KK
7 patentsUS9396998B2Jul 19, 2016
Semiconductor device having fan-in and fan-out redistribution layers
TOSHIBA KK62 citations98
US9728519B2Aug 8, 2017
Bonding method of semiconductor chip and bonding apparatus of semiconductor chip
TOSHIBA KK6 citations84
US10991673B2Apr 27, 2021
Electronic device
TOSHIBA KK3 citations73
US10847497B2Nov 24, 2020
Bonding method of semiconductor chip and bonding apparatus of semiconductor chip
TOSHIBA KK1 citations73
US9721935B2Aug 1, 2017
Semiconductor device and manufacturing method thereof
TOSHIBA KK2 citations73
US9595507B2Mar 14, 2017
Semiconductor device and method of manufacturing the same
TOSHIBA KK4 citations73
US10203460B2Feb 12, 2019
Optical semiconductor module
TOSHIBA KK2 citations72
NEC CORP
5 patentsUS7034386B2Apr 25, 2006
Thin planar semiconductor device having electrodes on both surfaces and method of fabricating same
NEC CORP64 citations98
US8039756B2Oct 18, 2011
Multilayered wiring board, semiconductor device in which multilayered wiring board is used, and method for manufacturing the same
NEC CORP20 citations93
US7791186B2Sep 7, 2010
Wiring board, semiconductor device in which wiring board is used, and method for manufacturing the same
NEC CORP17 citations93
US7556983B2Jul 7, 2009
Thin planar semiconductor device having electrodes on both surfaces and method of fabricating same
NEC CORP16 citations93
US7880295B2Feb 1, 2011
Wiring board, semiconductor device in which wiring board is used, and method for manufacturing the same
NEC CORP9 citations84
KURITA YOICHIRO
3 patentsUS8541874B2Sep 24, 2013
Semiconductor device
KURITA YOICHIRO14 citations92
US8207605B2Jun 26, 2012
Semiconductor device having a sealing resin and method of manufacturing the same
KURITA YOICHIRO17 citations92
US8193033B2Jun 5, 2012
Semiconductor device having a sealing resin and method of manufacturing the same
KURITA YOICHIRO11 citations92
TOSHIBA MEMORY CORP
3 patentsUS10128223B2Nov 13, 2018
Semiconductor device and manufacturing method thereof
TOSHIBA MEMORY CORP8 citations84
US10096574B2Oct 9, 2018
Semiconductor device including protective film over a substrate
TOSHIBA MEMORY CORP6 citations83
US10497688B2Dec 3, 2019
Semiconductor device having stacked logic and memory chips
TOSHIBA MEMORY CORP5 citations73
KAWANO MASAYA
2 patentsTOSHIBA ELECTRONIC DEVICES & STORAGE CORP
1 patentSOEJIMA KOJI
1 patentNAGASE & CO LTD
1 patentShowing the top 50 of 91 patents by PatentIndex Score.