Inventor

GANI DAVID

SG35 patents

⚠️ This page may combine multiple inventors who share the name “GANI DAVID”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

GANI DAVID

ST MICROELECTRONICS PTE LTD

Wafer level proximity sensor

Air venting on proximity sensor

Overmold proximity sensor and associated methods

Proximity sensor with integrated ALS

Proximity sensor with integrated ALS

Ambient light sensor with light protection

Package with lead frame with improved lead design for discrete electrical components and manufacturing the same

Multi-chip package

Wafer level proximity sensor

Proximity sensor with integrated ALS

Multi-chip package

Semiconductor package with protected sidewall and method of forming the same

Semiconductor package with protected sidewall and method of forming the same

Slanted glass edge for image sensor package

Slanted glass edge for image sensor package

Crack detection integrity check

Crack detection integrity check

WLCSP package with different solder volumes

Package with electrical interconnection bridge

Electronic device comprising a support substrate and stacked electronic chips

Thin semiconductor chip using a dummy sidewall layer

Proximity and ranging sensor

Optical assembly including electrically conductive coupling member and related methods

Image sensor device with different width cell layers and related methods

Method for manufacturing a wafer level chip scale package (WLCSP)

Contact having an angled portion

ST MICROELECTRONICS LTD

Semiconductor package with gas release holes

Sensor die package

WLCSP with transparent substrate and method of manufacturing the same

WONG WINGSHENQ

Electromagnetic interference shielding on semiconductor devices

Method and system for shielding semiconductor devices from light

RAMASAMY ANANDAN

Embedded wafer level optical package structure and manufacturing method

ST MICROELECTRONICS INC

Package with lead frame with improved lead design for discrete electrical components and manufacturing the same

AKZO NOBEL NV

Solid phase supports

ORGANON NV

Vinyl sulphone modified polymer