Inventor
LEE YONG-JE
KR10 patents
⚠️ This page may combine multiple inventors who share the name “LEE YONG-JE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
7 patentsUS10147706B2Dec 4, 2018
Multi-chip package and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD4 citations69
US10784244B2Sep 22, 2020
Semiconductor package including multiple semiconductor chips and method of manufacturing the semiconductor package
SAMSUNG ELECTRONICS CO LTD5 citations68
US9252123B2Feb 2, 2016
Multi-chip package and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD5 citations67
US10679972B2Jun 9, 2020
Method of manufacturing multi-chip package
SAMSUNG ELECTRONICS CO LTD0 citations48
US10658326B2May 19, 2020
Bonding wire having a silver alloy core, wire bonding method using the bonding wire, and electrical connection part of semiconductor device using the bonding wire
SAMSUNG ELECTRONICS CO LTD0 citations45
US9652422B2May 16, 2017
Multi-bus system
SAMSUNG ELECTRONICS CO LTD0 citations37
US9442788B2Sep 13, 2016
Bus protocol checker, system on chip including the same, bus protocol checking method
SAMSUNG ELECTRONICS CO LTD0 citations37