Inventor

BURNS CARMEN D

US73 patents

⚠️ This page may combine multiple inventors who share the name “BURNS CARMEN D”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

BURNS CARMEN D

STAKTEK CORP

Ultra-high density warp-resistant memory module

High density lead-on-package fabrication method

Hermetically sealed ceramic integrated circuit heat dissipating package

Bus communication system for stacked high density integrated circuit packages

Ultra high density integrated circuit package

High density lead-on-package fabrication method and apparatus

Bus communication system for stacked high density integrated circuit packages

Ultra high density modular integrated circuit package

Ultra high density integrated circuit packages method

Lead-on-chip integrated circuit fabrication method

Ultra high density integrated circuit packages

Three-dimensional warp-resistant integrated circuit module method and apparatus

Lead-on-chip integrated circuit apparatus

Ultra high density integrated circuit packages

High density integrated circuit module with snap-on rail assemblies

Ultra high density integrated circuit packages method and apparatus

Ultra high density integrated circuit packages method and apparatus

Bus communication system for stacked high density integrated circuit packages with bifurcated distal lead ends

Bus communication system for stacked high density integrated circuit packages with trifurcated distal lead ends

Ultra high density integrated circuit packages

Wrap-resistant ultra-thin integrated circuit package fabrication method

Method of manufacturing an ultra-high density warp-resistant memory module

Ultra-high density warp-resistant memory module

Hermetically sealed integrated circuit lead-on package configuration

Method of forming a hermetically sealed circuit lead-on package

Method of manufacturing a high density integrated circuit module with complex electrical interconnect rails having electrical interconnect strain relief

Integrated circuit package with overlapped die on a common lead frame

Multi-signal rail assembly with impedance control for a three-dimensional high density integrated circuit package

Lead-on-chip integrated circuit apparatus

Ultra high density integrated circuit packages

Warp-resistent ultra-thin integrated circuit package fabrication method

Warp-resistent ultra-thin integrated circuit package fabrication method

Ultra high density integrated circuit packages method

NAT SEMICONDUCTOR CORP

Non-impact thermocompression gang bonding method

Process for hermetically encapsulating semiconductor devices

Gang bonding interconnect tape process and structure for semiconductor device automatic assembly

Tape operated semiconductor device packaging

Manufacture of bumped composite tape for automatic gang bonding of semiconductor devices

Antioxidant coating of copper parts for thermal compression gang bonding of semiconductive devices

Method of making gang bonding interconnect tape for semiconductive devices

Copper-to-gold thermal compression gang bonding of interconnect leads to semiconductive devices

STAKTEK GROUP LP

Method of manufacturing a surface mount package

High density integrated circuit module

Flexible circuit connector for stacked chip module

Flexible circuit connector for stacked chip module

Stacked micro ball grid array packages

High density integrated circuit module with complex electrical interconnect rails having electrical interconnect strain relief

Ultra high density integrated circuit packages

(unassigned)

Bus communication system for stacked high density integrated circuit packages having an intermediate lead frame

Method of assembling ultra high density integrated circuit packages