Inventor

WANG HUI-CHUAN

US74 patents

⚠️ This page may combine multiple inventors who share the name “WANG HUI-CHUAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

WANG HUI-CHUAN

HEADWAY TECHNOLOGIES INC

Low resistance tunneling magnetoresistive sensor with composite inner pinned layer

Multiple thermal annealing method for forming antiferromagnetic exchange biased magnetoresistive (MR) sensor element

TMR or CPP structure with improved exchange properties

Low resistance tunneling magnetoresistive sensor with natural oxidized double MgO barrier

Heusler alloy with insertion layer to reduce the ordering temperature for CPP, TMR, MRAM, and other spintronics applications

TMR device with Hf based seed layer

Magnetoresistive spin valve sensor with tri-layer free layer

Method for fabricating lead overlay (LOL) on the bottom spin valve GMR read sensor

Canted longitudinal patterned exchange biased dual-stripe magnetoresistive (DSMR) sensor element and method for fabrication thereof

Method of forming a second antiferromagnetic exchange-coupling layer for magnetoresistive (MR) and giant MR (GMR) applications

Planarizing method for fabricating an inductive magnetic write head for high density magnetic recording

Magnetic seed method for improving blocking temperature and shield to shield spacing in a TMR sensor

Low resistance tunneling magnetoresistive sensor with composite inner pinned layer

TMR device with surfactant layer on top of CoFexBy/CoFez inner pinned layer

TMR device with Hf based seed layer

Ultra thin seed layer for CPP or TMR structure

Tunneling magneto-resistive spin valve sensor with novel composite free layer

CoFe insertion for exchange bias and sensor improvement

Structure and process for composite free layer in CPP GMR device

Double layer spacer for antiparallel pinned layer in CIP/CPP GMR and MTJ devices

Anti-parallel longitudinal patterned exchange biased dual stripe magnetoresistive (DSMR) sensor element and method for fabrication thereof

Tunneling magneto-resistive spin valve sensor with novel composite free layer

Process of manufacturing a TMR device

Method of forming an improved AP1 layer for a TMR device

Method of fabricating novel seed layers for fabricating spin valve heads

Lead plating method for GMR head manufacture

Bottom spin valve sensor having a lead overlay (LOL) structure fabricated thereon

Easily manufactured exchange bias stabilization scheme

Canted longitudinal patterned exchange biased dual-stripe magnetoresistive (DSMR) sensor element and method for fabrication thereof

TMR device with low magnetostriction free layer

Copper alloy GMR recording head

Two step method to fabricate small dimension devices for magnetic recording applications

Magnetic seed for improving blocking temperature and shield to shield spacing in a TMR sensor

ZHAO TONG

TMR device with novel free layer structure

TMR device with novel free layer structure

TMR device with novel free layer structure

Low resistance tunneling magnetoresistive sensor with natural oxidized double MgO barrier

TMR device with novel free layer structure

Low resistance tunneling magnetoresistive sensor with natural oxidized double MgO barrier

TMR device with improved MgO barrier

WANG HUI-CHUAN

TMR device with low magnetorestriction free layer

Magnetic memory cell

Method to fabricate small dimension devices for magnetic recording applications

TMR device with novel free layer

ZHANG KUNLIANG

Seed layer for TMR or CPP-GMR sensor

TMR or CPP structure with improved exchange properties

Ultra low RA (resistance x area) sensors having a multilayer non-magnetic spacer between pinned and free layers

HEADWAY TECH INC

TMR device with novel free layer structure

TMR device with novel free layer structure

MAGIC TECHNOLOGIES INC

Method to form a nonmagnetic cap for the NiFe(free) MTJ stack to enhance dR/R