Inventor
THAVARAJAH MANICKAM
US13 patents
⚠️ This page may combine multiple inventors who share the name “THAVARAJAH MANICKAM”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
LSI LOGIC CORP
12 patentsUS5886398AMar 23, 1999
Molded laminate package with integral mold gate
LSI LOGIC CORP184 citations99
US5949137ASep 7, 1999
Stiffener ring and heat spreader for use with flip chip packaging assemblies
LSI LOGIC CORP156 citations95
US5998242ADec 7, 1999
Vacuum assisted underfill process and apparatus for semiconductor package fabrication
LSI LOGIC CORP90 citations94
US6867480B2Mar 15, 2005
Electromagnetic interference package protection
LSI LOGIC CORP29 citations91
US6933602B1Aug 23, 2005
Semiconductor package having a thermally and electrically connected heatspreader
LSI LOGIC CORP38 citations90
US5992242ANov 30, 1999
Silicon wafer or die strength test fixture using high pressure fluid
LSI LOGIC CORP21 citations90
US6872321B2Mar 29, 2005
Direct positive image photo-resist transfer of substrate design
LSI LOGIC CORP43 citations89
US6117695ASep 12, 2000
Apparatus and method for testing a flip chip integrated circuit package adhesive layer
LSI LOGIC CORP43 citations85
US6555914B1Apr 29, 2003
Integrated circuit package via
LSI LOGIC CORP7 citations72
US6603201B1Aug 5, 2003
Electronic substrate
LSI LOGIC CORP6 citations61
US6777803B2Aug 17, 2004
Solder mask on bonding ring
LSI LOGIC CORP1 citations46
US6801437B2Oct 5, 2004
Electronic organic substrate
LSI LOGIC CORP0 citations40