Inventor
LENZ ERIC
US29 patents
⚠️ This page may combine multiple inventors who share the name “LENZ ERIC”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
LAM RES CORP
18 patentsUS6949204B1Sep 27, 2005
Deformation reduction at the main chamber
LAM RES CORP415 citations99
US6432831B2Aug 13, 2002
Gas distribution apparatus for semiconductor processing
LAM RES CORP315 citations99
US6391787B1May 21, 2002
Stepped upper electrode for plasma processing uniformity
LAM RES CORP153 citations99
US6245192B1Jun 12, 2001
Gas distribution apparatus for semiconductor processing
LAM RES CORP407 citations99
US7712434B2May 11, 2010
Apparatus including showerhead electrode and heater for plasma processing
LAM RES CORP81 citations98
US6824627B2Nov 30, 2004
Stepped upper electrode for plasma processing uniformity
LAM RES CORP104 citations98
US6786175B2Sep 7, 2004
Showerhead electrode design for semiconductor processing reactor
LAM RES CORP99 citations98
US7525787B2Apr 28, 2009
Electrostatic chuck assembly with dielectric material and/or cavity having varying thickness, profile and/or shape, method of use and apparatus incorporating same
LAM RES CORP29 citations92
US6984288B2Jan 10, 2006
Plasma processor in plasma confinement region within a vacuum chamber
LAM RES CORP52 citations92
US6433484B1Aug 13, 2002
Wafer area pressure control
LAM RES CORP47 citations92
US7405521B2Jul 29, 2008
Multiple frequency plasma processor method and apparatus
LAM RES CORP35 citations91
US7393432B2Jul 1, 2008
RF ground switch for plasma processing system
LAM RES CORP19 citations84
US7632375B2Dec 15, 2009
Electrically enhancing the confinement of plasma
LAM RES CORP11 citations82
US8000082B2Aug 16, 2011
Electrostatic chuck assembly with dielectric material and/or cavity having varying thickness, profile and/or shape, method of use and apparatus incorporating same
LAM RES CORP5 citations74
US7946303B2May 24, 2011
Carrier for reducing entrance and/or exit marks left by a substrate-processing meniscus
LAM RES CORP4 citations72
US8822345B2Sep 2, 2014
Apparatus including gas distribution member supplying process gas and radio frequency (RF) power for plasma processing
LAM RES CORP2 citations63
US6712929B1Mar 30, 2004
Deformation reduction at the main chamber
LAM RES CORP3 citations63
US9694453B2Jul 4, 2017
Method and apparatus for physical confinement of a liquid meniscus over a semiconductor wafer
LAM RES CORP0 citations51
MAGNI ENRICO
3 patentsUS8813764B2Aug 26, 2014
Method and apparatus for physical confinement of a liquid meniscus over a semiconductor wafer
MAGNI ENRICO3 citations60
US8997684B2Apr 7, 2015
Prevention of particle adders when contacting a liquid meniscus over a substrate
MAGNI ENRICO2 citations56
US8580045B2Nov 12, 2013
Method and apparatus for physical confinement of a liquid meniscus over a semiconductor wafer
MAGNI ENRICO0 citations49