Inventor
LABUNSKY MICHAEL
US3 patents
Patents
3 patentsUS6132289AOct 17, 2000
Apparatus and method for film thickness measurement integrated into a wafer load/unload unit
LAM RES CORP101 citations94
US6328637B1Dec 11, 2001
Method and apparatus for conditioning a polishing pad used in chemical mechanical planarization
LAM RES CORP17 citations90
US6086460AJul 11, 2000
Method and apparatus for conditioning a polishing pad used in chemical mechanical planarization
LAM RES CORP41 citations90