Inventor

IKEYA MASAHISA

JP8 patents

Patents

8 patents

US5994716ANov 30, 1999

Integrated circuit and fabricating method and evaluating method of integrated circuit

OKI ELECTRIC IND CO LTD27 citations91

US5412236AMay 2, 1995

Compound semiconductor device and method of making it

OKI ELECTRIC IND CO LTD8 citations73

US6423559B2Jul 23, 2002

Integrated circuit and fabricating method and evaluating method of integrated circuit

OKI ELECTRIC IND CO LTD8 citations72

US6251696B1Jun 26, 2001

Method of forming integrated circuit with evaluation contacts electrically connected by forming via holes through the chip, and bonding the chip with a substrate

OKI ELECTRIC IND CO LTD13 citations72

US6919541B2Jul 19, 2005

Apparatus for preventing rapid temperature variation during wafer processing

OKI ELECTRIC IND CO LTD6 citations71

US6440846B1Aug 27, 2002

Method for forming semiconductor device

OKI ELECTRIC IND CO LTD9 citations71

US6413888B1Jul 2, 2002

Method and apparatus for preventing rapid temperature variation of wafers during processing

OKI ELECTRIC IND CO LTD5 citations71

US6867120B2Mar 15, 2005

Method of fabricating a semiconductor device with a gold conductive layer and organic insulating layer

OKI ELECTRIC IND CO LTD0 citations50