Inventor
HISAEDA YUTAKA
JP12 patents
⚠️ This page may combine multiple inventors who share the name “HISAEDA YUTAKA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HISAEDA YUTAKA
3 patentsUS8293142B2Oct 23, 2012
Composition containing fine silver particles, production method thereof, method for producing fine silver particles, and paste having fine silver particles
HISAEDA YUTAKA7 citations81
US8486310B2Jul 16, 2013
Composition containing fine silver particles, production method thereof, method for producing fine silver particles, and paste having fine silver particles
HISAEDA YUTAKA3 citations60
US8293144B2Oct 23, 2012
Composition containing fine silver particles, production method thereof, method for producing fine silver particles, and paste having fine silver particles
HISAEDA YUTAKA3 citations60
ENDOH KEIICHI
3 patentsUS8641929B2Feb 4, 2014
Low-temperature-sinterable bonding material, and bonding method using the bonding material
ENDOH KEIICHI9 citations79
US9240256B2Jan 19, 2016
Bonding material and bonding method using the same
ENDOH KEIICHI1 citations58
US8858700B2Oct 14, 2014
Bonding material using metal nanoparticles coated with C6-C8 fatty acids, and bonding method
ENDOH KEIICHI1 citations48
DOWA ELECTRONICS MATERIALS CO LTD
3 patentsUS10090275B2Oct 2, 2018
Bonding method using bonding material
DOWA ELECTRONICS MATERIALS CO LTD0 citations48
US10008471B2Jun 26, 2018
Bonding material and bonding method using the same
DOWA ELECTRONICS MATERIALS CO LTD0 citations48
US9721694B2Aug 1, 2017
Fine silver particle powder, method for manufacturing the same, silver paste using the powder and method of use of the paste
DOWA ELECTRONICS MATERIALS CO LTD0 citations42