P

Inventor

LANE RYAN DAVID

US17 patents

Patents

17 patents
US9379090B1Jun 28, 2016

System, apparatus, and method for split die interconnection

QUALCOMM INC43 citations92
US9368566B2Jun 14, 2016

Package on package (PoP) integrated device comprising a capacitor in a substrate

QUALCOMM INC7 citations84
US9209131B2Dec 8, 2015

Toroid inductor in redistribution layers (RDL) of an integrated device

QUALCOMM INC11 citations83
US10321575B2Jun 11, 2019

Integrated circuit (IC) module comprising an integrated circuit (IC) package and an interposer with embedded passive components

QUALCOMM INC8 citations82
US9577025B2Feb 21, 2017

Metal-insulator-metal (MIM) capacitor in redistribution layer (RDL) of an integrated device

QUALCOMM INC13 citations80
US10008316B2Jun 26, 2018

Inductor embedded in a package substrate

QUALCOMM INC4 citations72
US10170232B2Jan 1, 2019

Toroid inductor with reduced electromagnetic field leakage

QUALCOMM INC1 citations62
US10231324B2Mar 12, 2019

Staggered power structure in a power distribution network (PDN)

QUALCOMM INC1 citations61
US9153560B2Oct 6, 2015

Package on package (PoP) integrated device comprising a redistribution layer

QUALCOMM INC2 citations61
US9373583B2Jun 21, 2016

High quality factor filter implemented in wafer level packaging (WLP) integrated device

QUALCOMM INC0 citations52
US9362218B2Jun 7, 2016

Integrated passive device (IPD) on substrate

QUALCOMM INC0 citations52
US9324779B2Apr 26, 2016

Toroid inductor in an integrated device

QUALCOMM INC0 citations52
US9514966B2Dec 6, 2016

Apparatus and methods for shielding differential signal pin pairs

QUALCOMM INC1 citations51
US9245940B2Jan 26, 2016

Inductor design on floating UBM balls for wafer level package (WLP)

QUALCOMM INC1 citations51
US9484281B2Nov 1, 2016

Systems and methods for thermal dissipation

QUALCOMM INC1 citations50
US10051741B2Aug 14, 2018

Embedded layered inductor

QUALCOMM INC0 citations41
US9449762B2Sep 20, 2016

Embedded package substrate capacitor with configurable/controllable equivalent series resistance

QUALCOMM INC0 citations41