Inventor
QUINONES HORATIO
US33 patents
⚠️ This page may combine multiple inventors who share the name “QUINONES HORATIO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NORDSON CORP
14 patentsUS7762088B2Jul 27, 2010
Apparatus and method for dispensing discrete amounts of viscous material
NORDSON CORP54 citations95
US9808825B2Nov 7, 2017
Modular jetting devices
NORDSON CORP19 citations90
US7939125B2May 10, 2011
Viscous material noncontact jetting system
NORDSON CORP17 citations89
US6861278B2Mar 1, 2005
Method and apparatus for underfilling semiconductor devices
NORDSON CORP22 citations88
US9847265B2Dec 19, 2017
Flow metering for dispense monitoring and control
NORDSON CORP9 citations83
US9393586B2Jul 19, 2016
Dispenser and method of dispensing and controlling with a flow meter
NORDSON CORP10 citations83
US9314882B2Apr 19, 2016
Methods for vacuum assisted underfilling
NORDSON CORP6 citations83
US9120116B2Sep 1, 2015
Dispenser and method of dispensing and controlling with a flow meter
NORDSON CORP9 citations83
US9808826B2Nov 7, 2017
Modular jetting devices
NORDSON CORP4 citations82
US10300505B2May 28, 2019
Modular jetting devices
NORDSON CORP3 citations71
US7785667B2Aug 31, 2010
Method of controlling edge definition of viscous materials
NORDSON CORP2 citations54
US9674962B2Jun 6, 2017
Methods for continuously moving a fluid dispenser while dispensing amounts of a fluid material
NORDSON CORP0 citations49
US10646889B2May 12, 2020
Methods for continuously moving a fluid dispenser while dispensing amounts of a fluid material
NORDSON CORP0 citations48
US9027789B2May 12, 2015
Automated vacuum assisted valve priming system and methods of use
NORDSON CORP0 citations47
IBM
8 patentsUS6281573B1Aug 28, 2001
Thermal enhancement approach using solder compositions in the liquid state
IBM160 citations98
US6656770B2Dec 2, 2003
Thermal enhancement approach using solder compositions in the liquid state
IBM74 citations96
US6212070B1Apr 3, 2001
Zero force heat sink
IBM106 citations95
US4604644AAug 5, 1986
Solder interconnection structure for joining semiconductor devices to substrates that have improved fatigue life, and process for making
IBM396 citations95
US5805430ASep 8, 1998
Zero force heat sink
IBM33 citations90
US4962294AOct 9, 1990
Method and apparatus for causing an open circuit in a conductive line
IBM17 citations71
US4611746ASep 16, 1986
Process for forming improved solder connections for semiconductor devices with enhanced fatigue life
IBM5 citations61
US6016947AJan 25, 2000
Non-destructive low melt test for off-composition solder
IBM6 citations57
FISKE ERIK
3 patentsUS8074467B2Dec 13, 2011
Apparatus and method for dispensing discrete amounts of viscous material
FISKE ERIK15 citations89
US8181468B2May 22, 2012
Apparatus and method for dispensing discrete amounts of viscous material
FISKE ERIK11 citations82
US8578729B2Nov 12, 2013
Apparatus and method for dispensing discrete amounts of viscous material
FISKE ERIK11 citations81