Inventor
PALMER MARK J
US6 patents
Patents
6 patentsUS6153829ANov 28, 2000
Split cavity wall plating for an integrated circuit package
INTEL CORP56 citations91
US6008988ADec 28, 1999
Integrated circuit package with a heat spreader coupled to a pair of electrical devices
INTEL CORP37 citations90
US5721454AFeb 24, 1998
Integrated circuit package with a plurality of vias that are electrically connected to an internal ground plane and thermally connected to an external heat slug
INTEL CORP44 citations90
US5691569ANov 25, 1997
Integrated circuit package that has a plurality of staggered pins
INTEL CORP24 citations90
US5483099AJan 9, 1996
Standardized power and ground design for pin grid array packages
INTEL CORP46 citations88
US7020958B1Apr 4, 2006
Methods forming an integrated circuit package with a split cavity wall
INTEL CORP1 citations47