Inventor
NAM SHI-BAEK
KR7 patents
⚠️ This page may combine multiple inventors who share the name “NAM SHI-BAEK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
FAIRCHILD KR SEMICONDUCTOR LTD
4 patentsUS7199461B2Apr 3, 2007
Semiconductor package suitable for high voltage applications
FAIRCHILD KR SEMICONDUCTOR LTD78 citations97
US7315077B2Jan 1, 2008
Molded leadless package having a partially exposed lead frame pad
FAIRCHILD KR SEMICONDUCTOR LTD107 citations96
US6621152B2Sep 16, 2003
Thin, small-sized power semiconductor package
FAIRCHILD KR SEMICONDUCTOR LTD91 citations96
US6756689B2Jun 29, 2004
Power device having multi-chip package structure
FAIRCHILD KR SEMICONDUCTOR LTD123 citations92
SAMSUNG ELECTRONICS CO LTD
3 patentsUS5965947AOct 12, 1999
Structure of a semiconductor package including chips bonded to die bonding pad with conductive adhesive and chips bonded with non-conductive adhesive containing insulating beads
SAMSUNG ELECTRONICS CO LTD95 citations97
US6025651AFeb 15, 2000
Semiconductor package structures using epoxy molding compound pads and a method for fabricating the epoxy molding compound pads
SAMSUNG ELECTRONICS CO LTD55 citations94
US6742561B2Jun 1, 2004
Apparatus for die bonding
SAMSUNG ELECTRONICS CO LTD48 citations92