P

Inventor

WANG WEI-SHUN

US26 patents
⚠️ This page may combine multiple inventors who share the name “WANG WEI-SHUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TESSERA INC

8 patents
US9224717B2Dec 29, 2015

Package-on-package assembly with wire bonds to encapsulation surface

TESSERA INC76 citations97
US9093435B2Jul 28, 2015

Package-on-package assembly with wire bonds to encapsulation surface

TESSERA INC68 citations97
US10062661B2Aug 28, 2018

Package-on-package assembly with wire bonds to encapsulation surface

TESSERA INC5 citations84
US10593643B2Mar 17, 2020

Package-on-package assembly with wire bonds to encapsulation surface

TESSERA INC1 citations73
US9691731B2Jun 27, 2017

Package-on-package assembly with wire bonds to encapsulation surface

TESSERA INC1 citations62
US10833044B2Nov 10, 2020

Package-on-package assembly with wire bonds to encapsulation surface

TESSERA INC0 citations52
US9716075B2Jul 25, 2017

Semiconductor chip assembly and method for making same

TESSERA INC0 citations52
US9349672B2May 24, 2016

Microelectronic package

TESSERA INC0 citations52

INVENSAS CORP

5 patents
US9041227B2May 26, 2015

Package-on-package assembly with wire bond vias

INVENSAS CORP37 citations97
US9761558B2Sep 12, 2017

Package-on-package assembly with wire bond vias

INVENSAS CORP4 citations84
US11189595B2Nov 30, 2021

Package-on-package assembly with wire bond vias

INVENSAS CORP0 citations62
US9252122B2Feb 2, 2016

Package-on-package assembly with wire bond vias

INVENSAS CORP2 citations62
US10756049B2Aug 25, 2020

Package-on-package assembly with wire bond vias

INVENSAS CORP0 citations52

CHAU ELLIS

3 patents
US8836136B2Sep 16, 2014

Package-on-package assembly with wire bond vias

CHAU ELLIS84 citations98
US8404520B1Mar 26, 2013

Package-on-package assembly with wire bond vias

CHAU ELLIS112 citations98
US9105483B2Aug 11, 2015

Package-on-package assembly with wire bond vias

CHAU ELLIS60 citations97

ADEIA SEMICONDUCTOR SOLUTIONS LLC

2 patents
US11830845B2Nov 28, 2023

Package-on-package assembly with wire bonds to encapsulation surface

ADEIA SEMICONDUCTOR SOLUTIONS LLC4 citations74
US12494453B2Dec 9, 2025

Package-on-package assembly with wire bonds to encapsulation surface

ADEIA SEMICONDUCTOR SOLUTIONS LLC0 citations62

AVAGO TECHNOLOGIES GENERAL IP

2 patents
US10163808B2Dec 25, 2018

Module with embedded side shield structures and method of fabricating the same

AVAGO TECHNOLOGIES GENERAL IP1 citations51
US9865479B2Jan 9, 2018

Method of attaching components to printed cirucuit board with reduced accumulated tolerances

AVAGO TECHNOLOGIES GENERAL IP1 citations48

SATO HIROAKI

1 patent
US8618659B2Dec 31, 2013

Package-on-package assembly with wire bonds to encapsulation surface

SATO HIROAKI147 citations98

KANG TECK-GYU

1 patent
US9137903B2Sep 15, 2015

Semiconductor chip assembly and method for making same

KANG TECK-GYU13 citations83

TESSERA LLC

1 patent
US11424211B2Aug 23, 2022

Package-on-package assembly with wire bonds to encapsulation surface

TESSERA LLC1 citations73

ADEIA SEMICONDUCTOR TECH LLC

1 patent
US12211821B2Jan 28, 2025

Package-on-package assembly with wire bond vias

ADEIA SEMICONDUCTOR TECH LLC0 citations62

INVENSAS LLC

1 patent
US11735563B2Aug 22, 2023

Package-on-package assembly with wire bond vias

INVENSAS LLC0 citations62

MOHAMMED ILYAS

1 patent
US8299626B2Oct 30, 2012

Microelectronic package

MOHAMMED ILYAS5 citations62