Inventor
LEE KOOHONG
KR4 patents
Patents
4 patentsUS9287204B2Mar 15, 2016
Semiconductor device and method of bonding semiconductor die to substrate in reconstituted wafer form
STATS CHIPPAC LTD8 citations83
US9245770B2Jan 26, 2016
Semiconductor device and method of simultaneous molding and thermalcompression bonding
STATS CHIPPAC LTD7 citations82
US9721921B2Aug 1, 2017
Semiconductor device and method of bonding semiconductor die to substrate in reconstituted wafer form
STATS CHIPPAC LTD2 citations72
US9240331B2Jan 19, 2016
Semiconductor device and method of making bumpless flipchip interconnect structures
STATS CHIPPAC LTD4 citations71