Inventor

YEE JAEHAK

KR5 patents

⚠️ This page may combine multiple inventors who share the name “YEE JAEHAK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

STATS CHIPPAC LTD

4 patents

US9287204B2Mar 15, 2016

Semiconductor device and method of bonding semiconductor die to substrate in reconstituted wafer form

STATS CHIPPAC LTD8 citations83

US9245770B2Jan 26, 2016

Semiconductor device and method of simultaneous molding and thermalcompression bonding

STATS CHIPPAC LTD7 citations82

US9721921B2Aug 1, 2017

Semiconductor device and method of bonding semiconductor die to substrate in reconstituted wafer form

STATS CHIPPAC LTD2 citations72

US9240331B2Jan 19, 2016

Semiconductor device and method of making bumpless flipchip interconnect structures

STATS CHIPPAC LTD4 citations71

HU JUNWEI

1 patent

US9105647B2Aug 11, 2015

Method of forming perforated opening in bottom substrate of flipchip pop assembly to reduce bleeding of underfill material

HU JUNWEI5 citations60