Inventor
CHO KYONGSOON
KR16 patents
⚠️ This page may combine multiple inventors who share the name “CHO KYONGSOON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
14 patentsUS9177904B2Nov 3, 2015
Chip-on-film package and device assembly including the same
SAMSUNG ELECTRONICS CO LTD16 citations91
US9978694B2May 22, 2018
Semiconductor package and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD12 citations78
US11574943B2Feb 7, 2023
Semiconductor package
SAMSUNG ELECTRONICS CO LTD2 citations71
US10937771B2Mar 2, 2021
Semiconductor packages
SAMSUNG ELECTRONICS CO LTD3 citations71
US10347611B2Jul 9, 2019
Semiconductor packages having redistribution substrate
SAMSUNG ELECTRONICS CO LTD4 citations71
US9241407B2Jan 19, 2016
Tape film packages and methods of fabricating the same
SAMSUNG ELECTRONICS CO LTD4 citations71
US12389545B2Aug 12, 2025
Semiconductor packages having circuit boards
SAMSUNG ELECTRONICS CO LTD0 citations61
US12243886B2Mar 4, 2025
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations61
US11894405B2Feb 6, 2024
Image sensor package
SAMSUNG ELECTRONICS CO LTD0 citations61
US12532562B2Jan 20, 2026
Semiconductor device including semiconductor chips stacked in a multi-layer structure by a flip-chip bonding method
SAMSUNG ELECTRONICS CO LTD0 citations59
US9620389B2Apr 11, 2017
Methods of fabricating tape film packages
SAMSUNG ELECTRONICS CO LTD1 citations50
US12471401B2Nov 11, 2025
Image sensor package
SAMSUNG ELECTRONICS CO LTD0 citations46
US9313889B2Apr 12, 2016
Display apparatus
SAMSUNG ELECTRONICS CO LTD0 citations45
US9468102B2Oct 11, 2016
Display device
SAMSUNG ELECTRONICS CO LTD0 citations40