Inventor · disambiguated record
Kazumi Shinchi
Also filed as: SHINCHI KAZUMI
3 granted patents·38 citations·filing 2000–2003
69Inventor score
Technology areasH10W
Files withOKI ELECTRIC IND CO LTD3
Top patents by PatentIndex Score
3 records- 0181US6376278B1Methods for making a plurality of flip chip packages with a wafer scale resin sealing stepOKI ELECTRIC IND CO LTD·Filed 2000·Granted Apr 23, 2002·33 cites·16 claims
- 0246US6867069B2Semiconductor package with a chip connected to a wiring substrate using bump electrodes and underfilled with sealing resinOKI ELECTRIC IND CO LTD·Filed 2003·Granted Mar 15, 2005·3 cites·10 claims
- 0344US6635963B2Semiconductor package with a chip connected to a wiring substrate using bump electrodes and underfilled with sealing resinOKI ELECTRIC IND CO LTD·Filed 2002·Granted Oct 21, 2003·2 cites·12 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →