Inventor
TESHIMA TAKANORI
JP22 patents
⚠️ This page may combine multiple inventors who share the name “TESHIMA TAKANORI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
DENSO CORP
14 patentsUS6693350B2Feb 17, 2004
Semiconductor device having radiation structure and method for manufacturing semiconductor device having radiation structure
DENSO CORP56 citations96
US7145254B2Dec 5, 2006
Transfer-molded power device and method for manufacturing transfer-molded power device
DENSO CORP45 citations92
US7019395B2Mar 28, 2006
Double-sided cooling type semiconductor module
DENSO CORP53 citations92
US6963133B2Nov 8, 2005
Semiconductor device and method for manufacturing semiconductor device
DENSO CORP26 citations92
US6917103B2Jul 12, 2005
Molded semiconductor power device having heat sinks exposed on one surface
DENSO CORP33 citations92
US6384431B1May 7, 2002
Insulated gate bipolar transistor
DENSO CORP40 citations92
US6538308B1Mar 25, 2003
Semiconductor apparatus with heat radiation structure for removing heat from semiconductor element
DENSO CORP28 citations91
US7944045B2May 17, 2011
Semiconductor module molded by resin with heat radiation plate opened outside from mold
DENSO CORP7 citations83
US7009292B2Mar 7, 2006
Package type semiconductor device
DENSO CORP16 citations83
US6946730B2Sep 20, 2005
Semiconductor device having heat conducting plate
DENSO CORP11 citations74
US7009284B2Mar 7, 2006
Semiconductor apparatus with heat radiation structure for removing heat from semiconductor element
DENSO CORP10 citations72
US7193326B2Mar 20, 2007
Mold type semiconductor device
DENSO CORP3 citations62
US7049688B2May 23, 2006
Semiconductor device having a pair of heat sinks and method for manufacturing the same
DENSO CORP5 citations59
US7468318B2Dec 23, 2008
Method for manufacturing mold type semiconductor device
DENSO CORP0 citations51