Inventor
YOO CHAN
US8 patents
⚠️ This page may combine multiple inventors who share the name “YOO CHAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MICRON TECHNOLOGY INC
7 patentsUS10153221B1Dec 11, 2018
Face down dual sided chip scale memory package
MICRON TECHNOLOGY INC5 citations69
US11456286B2Sep 27, 2022
Semiconductor device assembly with through-package interconnect and associated systems, devices, and methods
MICRON TECHNOLOGY INC0 citations61
US8906743B2Dec 9, 2014
Semiconductor device with molded casing and package interconnect extending therethrough, and associated systems, devices, and methods
MICRON TECHNOLOGY INC1 citations61
US10615154B2Apr 7, 2020
Semiconductor device assembly with through-package interconnect and associated systems, devices, and methods
MICRON TECHNOLOGY INC0 citations51
US9978730B2May 22, 2018
Method of assembly semiconductor device with through-package interconnect
MICRON TECHNOLOGY INC0 citations51
US9508686B2Nov 29, 2016
Semiconductor device assembly with package interconnect extending into overlying spacer material, and associated systems, devices, and methods
MICRON TECHNOLOGY INC0 citations51
US10366934B2Jul 30, 2019
Face down dual sided chip scale memory package
MICRON TECHNOLOGY INC0 citations48