Inventor

SEKIYA YUKIO

JP2 patents

Patents

2 patents

US5828128AOct 27, 1998

Semiconductor device having a bump which is inspected from outside and a circuit board used with such a semiconductor device

FUJITSU LTD160 citations96

US5760469AJun 2, 1998

Semiconductor device and semiconductor device mounting board

FUJITSU LTD46 citations90