Inventor
TISDALE STEPHEN LEO
US10 patents
Patents
10 patentsUS6323436B1Nov 27, 2001
High density printed wiring board possessing controlled coefficient of thermal expansion with thin film redistribution layer
IBM156 citations97
US6268016B1Jul 31, 2001
Manufacturing computer systems with fine line circuitized substrates
IBM89 citations97
US5730890AMar 24, 1998
Method for conditioning halogenated polymeric materials and structures fabricated therewith
IBM35 citations95
US5863332AJan 26, 1999
Fluid jet impregnating and coating device with thickness control capability
IBM26 citations92
US5863447AJan 26, 1999
Method for providing a selective reference layer isolation technique for the production of printed circuit boards
IBM28 citations92
US5800858ASep 1, 1998
Method for conditioning halogenated polymeric materials and structures fabricated therewith
IBM20 citations92
US5709906AJan 20, 1998
Method for conditioning halogenated polymeric materials and structures fabricated therewith
IBM12 citations81
US6436803B2Aug 20, 2002
Manufacturing computer systems with fine line circuitized substrates
IBM11 citations73
US5874154AFeb 23, 1999
Structure including a partially electrochemically reduced halogenated polymeric containing layer and an electrically conductive pattern
IBM9 citations73
US6207351B1Mar 27, 2001
Method for pattern seeding and plating of high density printed circuit boards
IBM11 citations72