Inventor · disambiguated record
Tokumitsu Sakamoto
Also filed as: SAKAMOTO TOKUMITSU
5 granted patents·79 citations·filing 1991–1996
81Inventor score
Files withMITSUBISHI ELECTRIC CORP5
Top patents by PatentIndex Score
5 records- 0165US5489802APressure contact type semiconductor device and heat compensatorMITSUBISHI ELECTRIC CORP·Filed 1993·Granted Feb 6, 1996·41 cites·25 claims
- 0247US6020603ASemiconductor device with a beveled and chamfered outer peripheral portionMITSUBISHI ELECTRIC CORP·Filed 1996·Granted Feb 1, 2000·13 cites·6 claims
- 0343US5519231APressure-connection type semiconductor device having a thermal compensator in contact with a semiconductor base substrate in an alloy-free stateMITSUBISHI ELECTRIC CORP·Filed 1994·Granted May 21, 1996·15 cites·2 claims
- 0432US5633536APress contact type semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1995·Granted May 27, 1997·5 cites·20 claims
- 0529US5100809AMethod of manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1991·Granted Mar 31, 1992·5 cites·6 claims
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