Inventor
TAKENO SHOZUI
JP10 patents
Patents
10 patentsUS6875951B2Apr 5, 2005
Laser machining device
MITSUBISHI ELECTRIC CORP135 citations96
US6633376B1Oct 14, 2003
Apparatus for inspecting a printed circuit board
MITSUBISHI ELECTRIC CORP55 citations96
US6136668AOct 24, 2000
Method of dicing semiconductor wafer
MITSUBISHI ELECTRIC CORP62 citations96
US6972392B2Dec 6, 2005
Laser beam machining method for wiring board, laser beam machining apparatus for wiring board, and carbonic acid gas laser oscillator for machining wiring board
MITSUBISHI ELECTRIC CORP18 citations92
US6373026B1Apr 16, 2002
Laser beam machining method for wiring board, laser beam machining apparatus for wiring board, and carbonic acid gas laser oscillator for machining wiring board
MITSUBISHI ELECTRIC CORP17 citations92
US5532434AJul 2, 1996
Insulated wire
MITSUBISHI ELECTRIC CORP20 citations91
US5178725AJan 12, 1993
Method for working ceramic material
MITSUBISHI ELECTRIC CORP22 citations89
US5585018ADec 17, 1996
Laser cutting method eliminating defects in regions where cutting conditions are changed
MITSUBISHI ELECTRIC CORP42 citations88
US6690024B1Feb 10, 2004
Laser inspection apparatus
MITSUBISHI ELECTRIC CORP15 citations83
US6329671B1Dec 11, 2001
Semiconductor device and method of manufacturing the same
MITSUBISHI ELECTRIC CORP12 citations73