Inventor
GEALER CHARLES A
US12 patents
⚠️ This page may combine multiple inventors who share the name “GEALER CHARLES A”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
8 patentsUS6750551B1Jun 15, 2004
Direct BGA attachment without solder reflow
INTEL CORP120 citations97
US7166924B2Jan 23, 2007
Electronic packages with dice landed on wire bonds
INTEL CORP27 citations86
US11217516B2Jan 4, 2022
Stacked-chip packages in package-on-package apparatus, methods of assembling same, and systems containing same
INTEL CORP2 citations72
US6043560AMar 28, 2000
Thermal interface thickness control for a microprocessor
INTEL CORP11 citations72
US9397071B2Jul 19, 2016
High density interconnection of microelectronic devices
INTEL CORP2 citations62
US9842832B2Dec 12, 2017
High density interconnection of microelectronic devices
INTEL CORP0 citations52
US10555417B2Feb 4, 2020
Mainboard assembly including a package overlying a die directly attached to the mainboard
INTEL CORP0 citations48
US9617148B2Apr 11, 2017
Interposer for hermetic sealing of sensor chips and for their integration with integrated circuit chips
INTEL CORP1 citations48