Inventor

ROMIG MATTHEW D

US8 patents

⚠️ This page may combine multiple inventors who share the name “ROMIG MATTHEW D”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TEXAS INSTRUMENTS INC

4 patents

US9572261B2Feb 14, 2017

Conductive through-polymer vias for capacitative structures integrated with packaged semiconductor chips

TEXAS INSTRUMENTS INC8 citations82

US9842797B2Dec 12, 2017

Stacked die power converter

TEXAS INSTRUMENTS INC10 citations78

US8716068B2May 6, 2014

Method for contacting agglomerate terminals of semiconductor packages

TEXAS INSTRUMENTS INC2 citations61

US9852979B2Dec 26, 2017

Conductive through-polymer vias for capacitative structures integrated with packaged semiconductor chips

TEXAS INSTRUMENTS INC1 citations50

TATEISHI TETSUO

1 patent

US8299588B1Oct 30, 2012

Structure and method for uniform current distribution in power supply module

TATEISHI TETSUO37 citations91

HOWARD GREGORY E

1 patent

US8723337B2May 13, 2014

Structure for high-speed signal integrity in semiconductor package with single-metal-layer substrate

HOWARD GREGORY E6 citations67

EDWARDS DARVIN R

1 patent

US8643165B2Feb 4, 2014

Semiconductor device having agglomerate terminals

EDWARDS DARVIN R1 citations44

ROMIG MATTHEW D

1 patent

US8298870B2Oct 30, 2012

Method for connecting integrated circuit chip to power and ground circuits

ROMIG MATTHEW D0 citations43